MM 765: Semiconductor devices and their working principles

Lecture 10

Course instructor: Abhijeet L. Sangle

(alsangle@iitb.ac.in, +91 22 2159 6742)

Autumn 2026

Overview

Unlike the homojunctions studied earlier, we now explore junctions formed between dissimilar materials.

  • Schottky Barriers: Energy-band diagrams and ideal rectifying properties of metal-semiconductor junctions.
  • Nonideal Effects: Image-force-induced barrier lowering and interface states.
  • Current-Voltage Relationship: Thermionic emission theory.
  • Ohmic Contacts: Low-resistance junctions through ideal work function alignment or tunneling.
  • Semiconductor Heterojunctions: Junctions between materials with different bandgaps and Two-Dimensional Electron Gas (2-DEG).

The Schottky Barrier Diode

One of the earliest practical semiconductor devices was the metal-semiconductor diode, originally made by touching a metallic whisker to a crystal (point contact diode).

Modern vacuum and semiconductor technology allows for reliable and reproducible metal-semiconductor contacts.

Depending on the materials and doping, these contacts can be:

  • Rectifying: Called a Schottky Barrier Diode. Conducts current strongly in one direction, heavily blocking in the other.
  • Nonrectifying (Ohmic): Provides low-resistance conduction in both directions, crucial for connecting devices to the outside world.

We will focus heavily on rectifying contacts made on n-type semiconductors.

Energy Bands: Before Contact

Consider an ideal metal and n-type semiconductor before they are brought into contact.

  • \(e\Phi_m\) : Metal work function (energy required to remove an electron from the metal Fermi level to vacuum).
  • \(e\Phi_s\) : Semiconductor work function (from vacuum to the semiconductor Fermi level).
  • \(e\chi\) : Semiconductor electron affinity (energy required to remove an electron from the conduction band edge to vacuum).

Assume \(\Phi_m > \Phi_s\).

The Fermi level in the n-type semiconductor is initially higher than the Fermi level in the metal.

Before Contact

Energy Bands: Thermal Equilibrium

When contact is made, electrons flow from the semiconductor (higher energy) into the metal (lower energy) until the Fermi levels align.

This leaves behind positively charged donor ions in the semiconductor, creating a space charge (depletion) region.

\[ \Phi_{B0} = \Phi_m - \chi \]

\(\Phi_{B0}\) is the ideal Schottky barrier height. It is the potential barrier seen by electrons in the metal trying to move into the semiconductor.

\[ V_{bi} = \Phi_{B0} - \phi_n \]

Here \(e\phi_n\) is the difference between \(E_c\) and \(E_{Fs}\), and \(V_{bi}\) is the built-in potential barrier seen by electrons in the semiconductor trying to move into the metal.

Thermal Equilibrium

Applying Bias

Applying a voltage \(V_a\) across the junction alters the barrier for electrons in the semiconductor.

  • Reverse Bias (\(V_a < 0\)): Positive voltage on semiconductor. Barrier increases to \(e(V_{bi} + V_R)\). Negligible current flows.
  • Forward Bias (\(V_a > 0\)): Positive voltage on metal. Barrier decreases to \(e(V_{bi} - V_a)\). Electrons easily flow into the metal.

Note: The barrier \(e\Phi_{B0}\) for electrons in the metal remains essentially constant in the ideal case.

Bias Voltage: 0.00 V

Ideal Junction Properties: Electrostatics

The electrostatics are nearly identical to a one-sided \(p^+n\) junction. Using Poisson's equation for a uniformly doped n-region:

\[ E(x) = -\frac{eN_d}{\epsilon_s}(x_n - x) \]

The electric field is linear, peaking at the interface (\(x=0\)).

\[ W = x_n = \left[ \frac{2\epsilon_s(V_{bi} + V_R)}{eN_d} \right]^{1/2} \]

The space charge width \(W\) increases with reverse bias \(V_R\).

\[ |E_{max}| = \frac{eN_d x_n}{\epsilon_s} = \left[ \frac{2eN_d(V_{bi} + V_R)}{\epsilon_s} \right]^{1/2} \]
Electrostatics Profile

Junction Capacitance

A capacitance exists due to the separation of charge in the depletion region. The space charge density per unit area is \(Q' = e N_d x_n\). Substituting \(x_n\), we get:

\[ Q' = \sqrt{2e\epsilon_s N_d (V_{bi} + V_R)} \]

The capacitance per unit area \(C'\) is the derivative of charge with respect to voltage:

\[ C' = \frac{dQ'}{dV_R} = \left[ \frac{e\epsilon_s N_d}{2(V_{bi} + V_R)} \right]^{1/2} \]

Squaring the reciprocal yields a linear relationship with \(V_R\):

\[ \left(\frac{1}{C'}\right)^2 = \frac{2(V_{bi} + V_R)}{e\epsilon_s N_d} \]

The slope is inversely proportional to doping \(N_d\), and the intercept on the voltage axis gives \(-V_{bi}\).

Doping \(N_d\): 1x

Schottky Barrier Lowering: Image Force

An electron in the semiconductor at distance \(x\) from the interface induces a positive image charge in the metal at \(-x\).

The attractive Coulomb force modifying the barrier is \(F = \frac{-e^2}{4\pi\epsilon_s (2x)^2} = \frac{-e^2}{16\pi\epsilon_s x^2}\).

The potential energy is found by integrating the force: \(PE = -\int F dx = \frac{-e^2}{16\pi\epsilon_s x}\).

When an external electric field \(E\) is applied, the total potential energy becomes:

\[ PE(x) = \frac{-e^2}{16\pi\epsilon_s x} - eEx \]

Setting the derivative to zero finds the position of the maximum barrier, \(x_m\):

\[ x_m = \sqrt{\frac{e}{16\pi\epsilon_s E}} \]

Substituting \(x_m\) back into the energy equation gives the barrier lowering \(\Delta\phi\):

\[ \Delta\phi = \sqrt{\frac{eE}{4\pi\epsilon_s}} \]
Image Charge Force

Schottky Barrier Lowering: Potential Plot

As derived, the attractive image force modifies the potential energy barrier for electrons. When an external electric field \(E\) is present, the peak of the barrier is lowered.

The amount of image-force-induced lowering (or Schottky effect) is:

\[ \Delta\phi = \sqrt{\frac{eE}{4\pi\epsilon_s}} \]

This peak occurs at a distance \(x_m\) from the metallurgical interface:

\[ x_m = \sqrt{\frac{e}{16\pi\epsilon_s E}} \]

This lowering effectively increases the reverse-bias saturation current as applied reverse voltage increases.

Electric Field:

Nonideal Effect: Interface States

The periodic crystal lattice is abruptly terminated at the metal-semiconductor interface, creating allowed electronic energy states within the bandgap called interface states.

A narrow interfacial layer of oxide (\(\delta \approx 10\text{-}20~\text{Å}\)) typically exists between the metal and semiconductor. Because it is a thin insulator, it can support a potential difference \(\Delta V = E_{ox} \delta\).

Fermi Level Pinning

Interface states store charge \(Q_{ss}\). If the density of interface states (\(D_{it}\)) is very high, even a tiny shift in the Fermi level at the surface creates a massive surface charge. This charge requires a huge voltage drop \(\Delta V\) across the \(\delta\) layer, effectively absorbing the entire work function difference.

As a result, the Fermi level becomes "stuck" or "pinned" at a neutral energy level (\(\phi_0\)). In this limit, the barrier height becomes independent of the metal work function: \(\Phi_{B0} \approx E_g - e\phi_0\).

Interface States & Pinning

Current-Voltage Relationship: Theory

Current transport in a Schottky diode is governed by Thermionic Emission Theory. Only majority carriers with sufficient kinetic energy to overcome the potential barrier can cross the junction.

The current from the semiconductor to the metal, \(J_{s \to m}\), depends exponentially on the barrier height from the semiconductor side (\(\Phi_{Bn} - V_a\)):

\[ J_{s \to m} \propto \exp\left(\frac{-e(\Phi_{Bn} - V_a)}{kT}\right) = J_{sT}\exp\left(\frac{eV_a}{kT}\right) \]

The current from the metal to the semiconductor, \(J_{m \to s}\), depends only on the barrier \(\Phi_{Bn}\) and remains constant at \(-J_{sT}\).

Summing these yields the total current density \(J\):

\[ J = J_{sT} \left[ \exp\left(\frac{eV_a}{kT}\right) - 1 \right] \]

Where \(J_{sT}\) is the reverse-saturation current density: \( J_{sT} = A^* T^2 \exp\left(\frac{-e\Phi_{Bn}}{kT}\right) \)

And \(A^*\) is the effective Richardson constant (\(A^* = \frac{4\pi e m_n^* k^2}{h^3}\)), which inherently depends on the effective mass of the semiconductor.

Thermionic Emission: Dynamic Balance

Under zero bias, the barrier is exactly balanced. The flow of electrons from the semiconductor into the metal (\(J_{s \to m}\)) perfectly counteracts the flow from the metal into the semiconductor (\(J_{m \to s}\)).

Under forward bias (\(V_a > 0\)), the semiconductor barrier is lowered. Electrons exponentially flood over the barrier into the metal. \(J_{m \to s}\) remains constant.

Under reverse bias (\(V_a < 0\)), the semiconductor barrier increases. \(J_{s \to m}\) shrinks to zero, leaving only the small, constant reverse saturation current \(J_{m \to s} = -J_{sT}\).

Bias Voltage: 0.00 V

Comparison: I-V Characteristics

The form of the ideal I-V equation is identical for both Schottky and pn junction diodes. However, the current mechanisms are completely different.

  • pn Junction: Minority carrier diffusion.
  • Schottky Diode: Majority carrier thermionic emission.

Key Consequence:

The reverse-saturation current \(J_{sT}\) for a Schottky diode is orders of magnitude larger than \(J_s\) for a pn junction.

Therefore, the effective turn-on voltage of a Schottky diode is significantly less (e.g., ~0.3V vs ~0.7V for Silicon).

I-V Comparison: Forward & Reverse Bias (Linear Scale)

Comparison: Charge Transport Mechanism

The I-V equation has the same form for both diodes, but watch what is actually crossing the junction — the mechanisms are nothing alike.

  • Schottky: electrons cross straight from the semiconductor's conduction band into the metal and are absorbed almost immediately. They stay majority carriers the whole time — nothing is ever injected as a minority carrier.
  • pn Junction: forward bias pushes electrons from the n-side and holes from the p-side across into the opposite region, where each becomes a minority carrier. They diffuse a short distance before recombining.

Why this matters:

This is exactly why the Schottky diode has no stored minority charge to remove when switching off (next slide) — there was never any minority-carrier injection to begin with.

Charge Motion Under Forward Bias

Comparison: Switching Speed

The second major difference lies in their frequency response and switching characteristics.

The Schottky diode is a majority carrier device.

  • There is no significant minority carrier injection.
  • This means there is no diffusion capacitance in forward bias.
  • When switching from forward to reverse bias, there is no stored minority carrier charge to remove.

Result: Schottky diodes are exceptionally fast. Typical switching times are in the picosecond range, compared to nanoseconds for pn junctions.

Turn-Off Transient Comparison

Metal-Semiconductor Ohmic Contacts

Every semiconductor device must make contact with the outside world. This requires connections that do not restrict current flow.

An Ohmic Contact is a low-resistance junction providing conduction in both directions.

Ideally, the current through an ohmic contact is a linear function of applied voltage, and the voltage drop across the contact should be negligibly small.

Two general ways to create ohmic contacts:

  • Ideal Nonrectifying Barrier: Achieved by choosing a metal with a specific work function relative to the semiconductor.
  • Tunneling Barrier: Achieved by heavily doping the semiconductor near the interface, making the barrier thin enough for electrons to tunnel through.

Drag the slider to see, for an n-type semiconductor, exactly which choice of metal work function gives which kind of contact.

Ohmic or Schottky? (n-type semiconductor)
0.00 eV

Ideal Nonrectifying Barrier (n-type)

For an n-type semiconductor, an ideal nonrectifying contact is formed when the metal work function (\(\Phi_m\)) is less than the semiconductor work function (\(\Phi_s\)).

Condition: \(\Phi_m < \Phi_s\)

To align the Fermi levels in thermal equilibrium, electrons flow from the metal into the lower energy states of the semiconductor.

This creates an accumulation layer of electrons at the semiconductor surface, curving the bands downwards.

There is no depletion region and no potential barrier for electrons flowing from the semiconductor to the metal. With applied bias, electrons easily flow in both directions.

Contact & Bias (n-type)

Ideal Nonrectifying Barrier (p-type)

For a p-type semiconductor, an ideal nonrectifying contact is formed when the metal work function (\(\Phi_m\)) is greater than the semiconductor work function (\(\Phi_s\)).

Condition: \(\Phi_m > \Phi_s\)

To align the Fermi levels, electrons flow from the semiconductor into the metal, leaving behind empty states (holes).

This creates an accumulation layer of holes at the semiconductor surface, curving the bands upwards.

Similar to the n-type case, this accumulation region presents no barrier for majority carriers (holes), yielding an Ohmic contact.

Contact (p-type)

The Tunneling Barrier

In practice, surface states pin the Fermi level, making it extremely difficult to find a metal that forms an ideal ohmic contact. A different approach is needed.

Recall that the depletion width \(W\) is inversely proportional to the square root of the doping concentration \(N_d\):

\[ W \propto \sqrt{\frac{1}{N_d}} \]

By heavily doping the semiconductor near the interface (\(N_d \approx 10^{19} - 10^{20} \text{ cm}^{-3}\)), the depletion width becomes incredibly thin (e.g., ~10-20 Å).

At these extremely narrow widths, quantum mechanical tunneling dominates. Electrons do not need thermal energy to go over the barrier; instead, they tunnel directly through the barrier horizontally.

Doping \(N_d\): 1016.0

Specific Contact Resistance (\(R_c\))

A figure of merit for an ohmic contact is the Specific Contact Resistance, defined as the inverse of the slope of the J-V curve at zero bias.

\[ R_c = \left( \frac{\partial J}{\partial V} \right)^{-1}_{V=0} \quad [\Omega \cdot \text{cm}^2] \]

For low doping (Thermionic Emission dominates):

\[ R_c \propto \exp\left(\frac{e\Phi_{Bn}}{kT}\right) \]

For high doping (Tunneling dominates):

\[ R_c \propto \exp\left[ \frac{2\sqrt{\epsilon_s m_n^*}}{\hbar} \frac{\Phi_{Bn}}{\sqrt{N_d}} \right] \]
\(R_c\) vs. Doping Concentration

Semiconductor Heterojunctions

A homojunction uses the same semiconductor material throughout (e.g., a Silicon pn junction).

A heterojunction is formed between two different semiconductor materials (e.g., GaAs and AlGaAs).

  • Lattice Matching: To avoid interface defects (dislocations), the two materials must have very similar lattice constants.
  • GaAs and \(\text{Al}_{x}\text{Ga}_{1-x}\text{As}\) are closely matched (~0.14% difference), making them ideal for heterojunctions.
  • Bandgap Discontinuity: Because the materials have different bandgaps, there will be discontinuities (steps) in the conduction and valence bands at the interface.

Energy-Band Alignment

The most common alignment is the Straddling case, where the narrow bandgap is entirely within the wide bandgap.

According to the ideal Electron Affinity Rule, the conduction band discontinuity (\(\Delta E_c\)) is the difference between the electron affinities (\(\chi\)):

\[ \Delta E_c = e(\chi_{narrow} - \chi_{wide}) \]

The valence band discontinuity (\(\Delta E_v\)) accounts for the rest of the bandgap difference:

\[ \Delta E_v = \Delta E_g - \Delta E_c \]
Before Contact

Isotype and Anisotype Junctions

Heterojunctions are classified by their doping types. We use capital letters for the wide-bandgap material and lowercase for the narrow-bandgap material.

  • Anisotype: Doping type changes at the junction (e.g., nP or Np). These act similarly to homojunction diodes but with asymmetric barriers for electrons and holes.
  • Isotype: Doping type is the same on both sides (e.g., nN or pP).

In an nP junction, the built-in potential is the sum of the potential drops on both sides. The depletion width is shared, much like a homojunction.

Thermal Equilibrium nP Junction

Two-Dimensional Electron Gas (2-DEG)

In an isotype nN junction (e.g., undoped GaAs and highly doped N-AlGaAs), electrons flow from the wide-gap AlGaAs into the narrow-gap GaAs to reach thermal equilibrium.

This creates a triangular potential well at the interface on the GaAs side. Crucially, the conduction band in the GaAs dips below the Fermi level, allowing it to become populated with electrons.

Electrons are confined in this narrow well (quantized in the z-direction) but are free to move parallel to the interface (x-y plane). This forms a Two-Dimensional Electron Gas (2-DEG).

High Electron Mobility Transistor (HEMT)

Because the 2-DEG electrons reside in the undoped GaAs, they suffer minimal ionized impurity scattering, leading to exceptionally high mobility.

2-DEG Quantum Well

2-DEG: Quantum Confinement

The triangular potential well in the GaAs is incredibly narrow, often less than 10 nm wide at the Fermi level.

This strong spatial restriction perpendicular to the interface (the z-direction) leads to quantum confinement.

The electron energy is quantized into discrete levels or subbands (\(E_0, E_1, \dots\)).

Probability Density (\(|\psi|^2\))

The graphic shows the probability density for the ground state (\(|\psi_0|^2\)) and first excited state (\(|\psi_1|^2\)). Electrons in the 2-DEG predominantly reside in the ground state \(E_0\), pushed tightly against the interface.

Subbands & Wavefunctions

Lecture Summary

  • Schottky Barrier Diodes: Formed by a metal contact on a lightly doped semiconductor, creating a rectifying potential barrier \(\Phi_{B0}\). Current is governed by thermionic emission of majority carriers, leading to a much larger reverse saturation current, lower turn-on voltage, and vastly superior switching speeds compared to pn junctions due to the lack of minority carrier storage.
  • Junction Properties & Nonideal Effects: Electrostatics are mathematically identical to a one-sided \(p^+n\) junction. Nonideal effects like image-force-induced barrier lowering cause reverse current to increase with bias, while high interface state densities can cause Fermi level pinning, making the barrier height independent of the metal work function.
  • Ohmic Contacts: Essential for connecting devices without restricting current flow. They can be created ideally by specific work function differences (\(\Phi_m < \Phi_s\) for n-type) to form an accumulation layer, or practically by heavily doping the surface to thin the barrier enough for tunneling to dominate.
  • Semiconductor Heterojunctions: Junctions combining lattice-matched materials with different bandgaps (e.g., GaAs/AlGaAs), resulting in conduction and valence band discontinuities.
  • Two-Dimensional Electron Gas (2-DEG): In isotype (e.g., nN) heterojunctions, band bending can create a triangular quantum well that traps electrons, forming a 2-DEG. This allows for extremely high electron mobility by physically separating the conduction electrons from ionized impurities, a principle used in HEMTs.